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LCD and Camera EMI Filter Array with ESD Protection CM1426
Features
* * * * * * * * * * Four, six and eight channels of EMI filtering with integrated ESD protection 0.5mm pitch, 10-bump, 1.96mm x 1.33mm footprint Chip Scale Package (CM1426-04) 0.5mm pitch, 15-bump, 2.96mm x 1.33mm footprint Chip Scale Package (CM1426-06) 0.5mm pitch, 20-bump, 3.96mm x 1.33mm footprint Chip Scale Package (CM1426-08) Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network 8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) 15kV ESD protection on each channel (HBM) Greater than 20dB attenuation (typical) at 1 GHz OptiGuardTM coated for improved reliability at assembly RoHS-compliant, lead-free packaging
Product Description
The CM1426 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in a Chip Scale Package with 0.50mm pad pitch. The CM1426 has component values of 8.5pF-100-8.5pF per channel. The CM1426 has a cut-off frequency of 230MHz and can be used in applications where the data rates are as high as 92Mbps. The parts include avalanche-type ESD diodes on every pin that provide a very high level of protection for sensitive electronic components against possible ESD strikes. The ESD protection diodes safely dissipate ESD strikes of 8kV, well beyond the maximum requirement of the IEC610004-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 15kV. These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1426 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1426 incorporates OptiguardTM which results in improved reliability at assembly. The CM1426 is available in a space-saving, low-profile Chip Scale Package.
Applications
* * * * * * LCD and camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules
(c)2010 SCILLC. All rights reserved. April 2010 Rev. 2
Publication Order Number: CM1426/D
CM1426
Block Diagram
Electrical Schematic
1 of 4, 6 or 8 EMI/RFI + ESD Channels
Rev. 2 | Page 2 of 17 | www.onsemi.com
CM1426
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 A7 A8 B1-B4 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Device Ground PIN(s) C1 C2 C3 C4 C5 C6 C7 C8 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8
Ordering Information
PART NUMBERING INFORMATION
Bumps
10 15 20
Package
CSP CSP CSP
Ordering Part Number
CM1426-04CP CM1426-06CP CM1426-08CP
1
Part Marking
N264 N266 N268
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range DC Power per Resistor DC Package Power Rating
RATING
-65 to +150 100 500
UNITS
C mW mW
Rev. 2 | Page 3 of 17 | www.onsemi.com
CM1426
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
-40 to +85
UNITS
C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL
R CTOTAL C
PARAMETER
Resistance Total Channel Capacitance
CONDITIONS
MIN
80
TYP
100 17
MAX
120 20.4
UNITS
pF
At 2.5VDC Reverse Bias, 1MHz, 30mVAC At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE=10A VDIODE= 3.3V
13.6
Capacitance C1
6.8
8.5
10.2
pF
VDIODE ILEAK VSIG
Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50, ZLOAD=50
6.0 0.1 1
V A
ILOAD = 10mA ILOAD = -10mA Note 2
5.6 -1.5
6.8 -0.8
9.0 -0.4
V V
VESD
15 8
kV kV
RDYN
2.3 0.9 R=100, C=17pF 230

fC
MHz
Note 1: TA=25 unless otherwise specified. C Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Rev. 2 | Page 4 of 17 | www.onsemi.com
CM1426
Performance Information
Typical Filter Performance (TA=25 DC Bias=0V, 50 Ohm Environment) C,
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)
Rev. 2 | Page 5 of 17 | www.onsemi.com
CM1426
Performance Information (cont'd)
Typical Filter Performance (TA=25 DC Bias=0V, 50 Ohm Environment) C,
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
Rev. 2 | Page 6 of 17 | www.onsemi.com
CM1426
Performance Information (cont'd)
Typical Filter Performance (TA=25 DC Bias=0V, 50 Ohm Environment) C,
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)
Rev. 2 | Page 7 of 17 | www.onsemi.com
CM1426
Performance Information (cont'd)
Typical Filter Performance (TA=25 DC Bias=0V, 50 Ohm Environment) C,
Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4)
Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4)
Rev. 2 | Page 8 of 17 | www.onsemi.com
CM1426
Performance Information (cont'd)
Typical Diode Capacitance vs. Input Voltage
Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25 C)
Rev. 2 | Page 9 of 17 | www.onsemi.com
CM1426
Application Information
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260 C
N on-Solder M ask D efined Pad 0.240m D m IA.
Solder Stencil Opening 0.300m D m IA.
Solder Mask Opening 0.290m D m IA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 10 of 17 | www.onsemi.com
CM1426
Mechanical Details
CSP Mechanical Specifications CM1426 devices are supplied in custom Chip Scale Packages (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. CM1426-04 Mechanical Specifications Package dimensions are presented below.
PACKAGE DIMENSIONS
Package Bumps Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 1.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.575 0.368 Millimeters Nom 1.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.644 0.419 Max Min Custom CSP 10 Inches Nom Max
2.005 0.0754 0.0772 0.0789 1.375 0.0506 0.0524 0.0541 0.505 0.0195 0.0197 0.0199 0.255 0.0096 0.0098 0.0100 0.440 0.0169 0.0171 0.0173 0.440 0.0169 0.0171 0.0173 0.280 0.0071 0.0091 0.0110 0.280 0.0071 0.091 0.0110
Package Dimensions for CM1426-04 Chip Scale Package
0.714 0.0226 0.0254 0.0281 0.470 0.0145 0.0165 0.0185 3500 pieces
# per tape and reel
Controlling dimension: millimeters
Rev. 2 | Page 11 of 17 | www.onsemi.com
CM1426
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 2.08 x 1.45 x 0.71 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500
PART NUMBER CM1426-04
CHIP SIZE (mm) 1.96 x 1.33 x 0.644
P0 4mm
P1 4mm
Figure 12. Tape and Reel Mechanical Data
Rev. 2 | Page 12 of 17 | www.onsemi.com
CM1426
Mechanical Details (cont'd)
CM1426-06 Mechanical Specifications The package dimensions for the CM1426-06 are presented below.
PACKAGE DIMENSIONS
Package Bumps Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.575 0.368 Millimeters Nom 2.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.644 0.419 Max Min Custom CSP 15 Inches Nom Max
3.005 0.1148 0.1165 0.1183 1.375 0.0506 0.0524 0.0541 0.505 0.0195 0.0197 0.0199 0.255 0.0096 0.0098 0.0100 0.440 0.0169 0.0171 0.0173 0.440 0.0169 0.0171 0.0173 0.280 0.0071 0.0091 0.0110 0.280 0.0071 0.091 0.0110
Package Dimensions for CM1426-06 Chip Scale Package
0.714 0.0226 0.0254 0.0281 0.470 0.0145 0.0165 0.0185 3500 pieces
# per tape and reel
Controlling dimension: millimeters
Rev. 2 | Page 13 of 17 | www.onsemi.com
CM1426
CSP Tape and Reel Specifications
QTY PER REEL 3500
PART NUMBER CM1426-06
CHIP SIZE (mm) 2.96 x 1.33 x 0.644
POCKET SIZE (mm) B0 X A0 X K0 3.10 x 1.45 x 0.74
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
P0 4mm
P1 4mm
Figure 13. Tape and Reel Mechanical Data
Rev. 2 | Page 14 of 17 | www.onsemi.com
CM1426
Mechanical Details (cont'd)
CM1426-08 Mechanical Specifications The package dimensions for the CM1426-08 are presented below.
PACKAGE DIMENSIONS
Package Bumps Dim Min A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 3.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.575 0.368 Millimeters Nom 3.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.644 0.419 Max Min Custom CSP 20 Inches Nom Max
4.005 0.1541 0.1559 0.1577 1.375 0.0506 0.0524 0.0541 0.505 0.0195 0.0197 0.0199 0.255 0.0096 0.0098 0.0100 0.440 0.0169 0.0171 0.0173 0.440 0.0169 0.0171 0.0173 0.280 0.0071 0.0091 0.0110 0.280 0.0071 0.091 0.0110
Package Dimensions for CM1426-08 Chip Scale Package
0.714 0.0226 0.0254 0.0281 0.470 0.0145 0.0165 0.0185 3500 pieces
# per tape and reel
Controlling dimension: millimeters
Rev. 2 | Page 15 of 17 | www.onsemi.com
CM1426
CSP Tape and Reel Specifications
PART NUMBER CM1426-08 POCKET SIZE (mm) B0 X A0 X K0 4.11 x 1.57 x 0.76 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500
CHIP SIZE (mm) 3.96 x 1.33 x 0.644
P0 4mm
P1 4mm
Figure 14. Tape and Reel Mechanical Data
Rev. 2 | Page 16 of 17 | www.onsemi.com
CM1426
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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Rev. 2 | Page 17 of 17 | www.onsemi.com

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